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DUKAS_188161484_NUR
Technology Trade Show
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G LGA Module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025. (Photo by Joan Cros/NurPhoto) -
DUKAS_188161477_NUR
Technology Trade Show
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G M.2 Module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025. (Photo by Joan Cros/NurPhoto) -
DUKAS_188161422_NUR
Technology Trade Show
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, including the X82 5G M.2 module and the LGA module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. These components are exhibited in the Qualcomm pavilion during the Mobile World Congress 2025. (Photo by Joan Cros/NurPhoto)