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  • Mobile World Congress Barcelona 2025
    DUKAS_185136319_NUR
    Mobile World Congress Barcelona 2025
    The model of a satellite is displayed over the MediaTek 6G Logo, one of the future projects of the Taiwanese semiconductor manufacturer to offer pervasive global connectivity, during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

     

  • Mobile World Congress Barcelona 2025
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    Mobile World Congress Barcelona 2025
    An image of MediaTek's flagship chip, the MediaTek Dimensity 9400, an all-big core CPU designed for AI-equipped smartphones by the Taiwanese semiconductor manufacturer, is displayed during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

     

  • Mobile World Congress Barcelona 2025
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    Mobile World Congress Barcelona 2025
    Congress attends the reading of the slogan ''AI Inside for a New Era'' above an image depicting a smart connected city at the MediaTek pavilion during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

     

  • Mobile World Congress Barcelona 2025
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    Mobile World Congress Barcelona 2025
    The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

     

  • Mobile World Congress Barcelona 2025
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    Mobile World Congress Barcelona 2025
    The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

     

  • Mobile World Congress Barcelona 2025
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    Mobile World Congress Barcelona 2025
    The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quectel Wireless Solutions, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

     

  • Technology Trade Show
    DUKAS_185113168_NUR
    Technology Trade Show
    The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

     

  • Technology Trade Show
    DUKAS_185113166_NUR
    Technology Trade Show
    The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

     

  • Technology Trade Show
    DUKAS_185113155_NUR
    Technology Trade Show
    The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quectel Wireless Solutions, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)

     

  • Technology Trade Show
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    Technology Trade Show
    In Barcelona, Spain, on March 5, 2025, Congress attends a reading of the theme ''AI Inside for a New Era'' above an image depicting a smart connected city at the MediaTek pavilion during the Mobile World Congress 2025. (Photo by Joan Cros/NurPhoto)

     

  • Technology Trade Show
    DUKAS_185113013_NUR
    Technology Trade Show
    The model of a satellite is displayed over the MediaTek 6G Logo, one of the future projects of the Taiwanese semiconductor manufacturer to offer pervasive global connectivity, during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto)